Comparison ledger
ABM -407B-1-S-CES293 Robot, Hanwha HM520MF, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | HM520MFHanwha | |
|---|---|---|
| OEM | ABM | Hanwha |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-1-S-CES293 Robot | Hanwha HM520MF |
| Specifications | ||
| Model | ABM-407B-1-S-CES293[1] | HM520MF[2] |
| Description | ROBOT[1] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[1] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[1] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[1] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[1] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[1] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[1] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[1] | — |
| Placement Accuracy Chip | — | ±40 μm @ Cpk ≥ 1.0[2] |
| IC | — | ±30 μm @ Cpk ≥ 1.0[2] |
| Gantry Configuration | — | Double Gantry with 6 Spindles per head (12 spindles total, Piano Type)[2] |
| Placement Speed | — | 60,000 CPH (Optimum)[2] |
| Placement Accuracy (IC) | — | ±30 μm @ Cpk ≥ 1.0[2] |
| Component Range | — | 0402 to □55 mm[2] |
| Max Component Height | — | 15 mm[2] |
| Feeder Capacity | — | 80 slots (8mm Docking Cart)[2] |
| PCB Thickness | — | 0.3 mm to 4.2 mm[2] |
| Machine Weight | — | Approx. 1,605 kg[2] |
| Dimensions (L × D × H) | — | 890 mm × 2,370 mm × 1,930 mm[2] |
| Placement Accuracy (Chip) (alternate) | — | ±25 μm @ Cpk ≥ 1.0[3] |
| Placement Speed (alternate) | — | 80,000 CPH[3] |
| Number of Spindles (alternate) | — | 20 spindles x 2 Gantry / 80,000 CPH[3] |
| Power Requirement | — | AC200/208/220/240/380/41SV±10% 3phase 50/60Hz[4] |
| Air Consumption | — | 100NI/min[4] |
| External Dimensions (LxDxH) | — | 890x2,312x1,921[4] |
| Serial Number | — | DM-0331[5] |
| Component Range (Fly) | — | 03015 ~ □16 mm[3] |
| Component Range (Fix) | — | ~□42 mm (Standard) / ~□55 mm (MFOV) / ~L75 mm Connector (MFOV)[3] |
| Feeder Capacity (Option) | — | 120 (Fixed feederbase / Docking Cart)[3] |
| Machine Weight (alternate) | — | Approx. 1,800 kg[3] |
| Dimensions L x D x H (alternate) | — | 1,430 x 1,740 x 1,485 mm[3] |
| PCB Size (Single) | — | 50 x 40 to 510 x 580mm (Standard); 50 x 40 to 750 x 580mm (Option)[4] |
| PCB Size (Double) | — | 510 x 310mm (Standard); 750x330mm (Option)[4] |
| Type | — | Pick and place machine[2] |
| Configuration | — | Double gantry with 6 spindles per head (12 spindles total, Piano Type)[2] |
| Placement speed | — | Up to 60,000 CPH (optimum)[2] |
| Placement accuracy | — | Chip: ±40 μm @ Cpk ≥ 1.0; IC: ±30 μm @ Cpk ≥ 1.0[2] |
| Component range | — | Metric 0402 to 55 mm square[2] |
| Maximum component height | — | 15 mm[2] |
| Dimensions | — | 890 mm × 2,370 mm × 1,930 mm[2] |
| Vintage | — | 2021[5] |
| Number of heads | — | Double gantry 6 heads (12 total)[4] |
| PCB size, single | — | 50 x 40 mm to 510 x 580 mm (standard); 50 x 40 mm to 750 x 580 mm (option)[4] |
| PCB thickness | — | 0.3 to 4.2 mm[4] |
| Feeder capacity | — | 80ea (8mm Docking Cart)[4] |
| Power | — | AC200/208/220/240/380/415V ±10%, 3 phase, 50/60Hz[4] |
| Additional accuracy statement | — | ±25 μm Cpk ≥ 1.0 for chip; ±30 μm Cpk ≥ 1.0 for IC[4] |
| Machine type | — | Pick and place machine[2] |
| Manufacturer | — | Hanwha[2] |
| Year | — | 2021[2] |
| Application description | — | PCB chip mounter[3] |
| Component height | — | 15 mm[2] |
| Feeder capacity (alternate listing) | — | 120 (8mm standard)[3] |
| Alternate accuracy listing | — | ±25 μm @ Cpk ≥ 1.0[3] |