Waferpedia

Comparison ledger

-407B-1-S-CES293 RobotversusGasonics L 3510 Asher / Stripper

ABM -407B-1-S-CES293 Robot, Lam Research Gasonics L 3510 Asher / Stripper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMABMLam Research
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyABM -407B-1-S-CES293 RobotLam Research Gasonics L 3510 Asher / Stripper
Specifications
ModelABM-407B-1-S-CES293[1]—
DescriptionROBOT[1]—
Refurbished RTP RTAAG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[1]—
KLA-Tencor Spare Parts and ServiceRS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[1]—
Refurbished Isotropic Plasma EtcherMatrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[1]—
Refurbished PECVD, ALD EquipmentCambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[1]—
Refurbished Mask AlignerCanon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[1]—
Refurbished BondingSUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[1]—
Refurbished Wafer ProberElectroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[1]—
Microwave Power—0–1200 W at 2.45 GHz[2]
Pressure Range—0.5 to >5.0 torr[2]
Platen Temperature—100–300°C[2]
Ash Rate—Up to 3.5 µm/min[2]
Throughput—45–60 WPH[2]
Within Wafer Uniformity—±5% to 10%[2]
Wafer-to-Wafer Uniformity—±5% to 10%[2]
Process Gas—O2, N2[2]
Wafer Size Support—75 mm to 200 mm (3 to 8 inch)[3]
Process Type—Downstream microwave plasma ashing[3]
Endpint Detection—Yes, typical[3]
Heating—Platen and lampe heating[2]
Sources (3)Every fact above is drawn from these public sources
  1. [1]dealer listingsemistarcorp.com
  2. [2]allwin21.comallwin21.com
  3. [3]semistarcorp.comsemistarcorp.com