Comparison ledger
ABM -407B-1-S-CES293 Robot, Panasonic NPM D 3 Chip Mounter, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | NPM D 3 Chip MounterPanasonic | |
|---|---|---|
| OEM | ABM | Panasonic |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-1-S-CES293 Robot | Panasonic NPM D 3 Chip Mounter |
| Cited variants | — |
|
| Specifications | ||
| Model | ABM-407B-1-S-CES293[2] | — |
| Description | ROBOT[2] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[2] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[2] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[2] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[2] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[2] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[2] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[2] | — |
| Model ID | — | NPM-D3[1] |
| Placement head type | — | Lightweight 16-nozzle head V3[1] |
| Max placement speed (H16 head, per head, high production mode ON) | — | 42,000 cph (0.086 s/chip)[1] |
| Max placement speed (H16, total) | — | 84,000 CPH (0.043 s/chip)[3] |
| Placement accuracy (H16 head) | — | ±40 µm/chip (Cpk≥1)[1] |
| Component dimensions (H16 head) | — | 0402 chip to L 6 x W 6 x T 3 mm[1] |
| PCB dimensions (single-lane mode) | — | L 50 x W 50 mm to L 510 x W 590 mm[1] |
| PCB dimensions (dual-lane mode) | — | L 50 x W 50 mm to L 510 x W 300 mm[1] |
| Power supply | — | 3-phase AC 200, 220, 380, 400, 420, 480 V, 2.7 kVA[1] |
| Air supply | — | 0.5 MPa, 100 L/min (A.N.R.)[1] |
| Machine dimensions (W x D x H) | — | 832 x 2,652 x 1,444 mm[1] |
| Machine weight (main body) | — | 1,680 kg[1] |
| PCB exchange time (dual-lane mode) | — | 0 s (when cycle time ≤ 3.6 s)[1] |
| PCB exchange time (single-lane mode) | — | 3.6 s (with short conveyors)[1] |
| Applicable components | — | 1608 chip to SOP, PLCC, QFP, Connector, BGA, CSP[1] |
| Machine dimensions (with tray feeder) | — | 832 x 2,683 x 1,444 mm[3] |
| Machine weight (with tray feeder) | — | 1,680 kg main body + 200 kg tray feeder[3] |
| Placement Speed (H16 head, high production mode) | — | 42,000 CPH per head (0.086 s/chip)[1] |
| Placement Speed (dual-beam, H16 head) | — | 84,000 CPH (0.043 s/chip)[3] |
| Placement Accuracy (H16 head, chip) | — | ±40 µm (Cpk≥1)[1] |
| Component Dimensions (H16 head) | — | 03015 to 6×6 mm, height max 3.0 mm[3] |
| PCB Dimensions (single-lane mode) | — | L 50 × W 50 ~ L 510 × W 590 mm[1] |
| PCB Dimensions (dual-lane mode) | — | L 50 × W 50 ~ L 510 × W 300 mm[1] |
| Machine Dimensions (W × D × H) | — | 832 × 2,652 × 1,444 mm (with tray feeder: D 2,683 mm)[1] |
| Mass (main body only) | — | 1,680 kg[1] |
| Electrical Power | — | 3-phase AC 200-480 V, 2.7 kVA[1] |
| Pneumatic Source | — | 0.5 MPa, 100 L/min (ANR)[1] |