Comparison ledger
ABM -407B-2-S-CE-S293 Robot, Bruker Dektak 150 High Performance Surface Profiler, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ||
|---|---|---|
| OEM | ABM | Bruker |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-2-S-CE-S293 Robot | Bruker Dektak 150 High Performance Surface Profiler |
| Cited variants | — |
|
| Specifications | ||
| Model | ABM-407B-2-S-CE-S293[2] | — |
| Description | ROBOT[2] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[2] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[2] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[2] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[2] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[2] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[2] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[2] | — |
| Measurement Technique | — | Contact stylus profilometry[1] |
| Scan Length Range | — | 55 mm standard; up to 200 mm with stitching option[1] |
| Data Points Per Scan | — | 120,000 maximum[1] |
| Max. Sample Thickness | — | Up to 90 mm[1] |
| Max. Wafer Size | — | 150 mm (200 mm with Advanced Automation Package)[1] |
| Step Height Repeatability | — | ≤6 Å (D150); ≤4 Å (D150+ option); 1 sigma on 0.1 μm step[1] |
| Vertical Range | — | 524 μm (1 mm optional)[1] |
| Vertical Resolution | — | 1 Å max. (at 6.55 μm range)[1] |
| Stylus Force | — | 1 to 15 mg with LIS 3 sensor; 0.03 to 15 mg with N-Lite sensor option[1] |
| Stylus Options | — | Radius options from 50 nm to 25 μm; HAR tips 10 μm x 2 μm and 200 μm x 20 μm[1] |
| Sample Stage | — | Manual X/Y/θ, 100 x 100 mm X-Y translation, 360° rotation, manual leveling; optional X-Y auto stage 150 mm travel, 1 μm repeatability; optional 200 mm wafer vacuum chuck; optional 6-inch square porous vacuum chuck[1] |
| Computer System | — | PC with Pentium D or Athlon processor[1] |
| Software | — | Dektak software running under Windows XP; Step Detection software (std.); optional Stress Measurement software; optional 3D Mapping with Vision analysis software; optional Stitching software[1] |
| Environment Temperature Range | — | Between 20 and 25°C (68 to 77°F)[1] |
| Humidity Range | — | ≤50% ±20°C, non-condensing[1] |
| Dimensions | — | 292 mm W x 508 mm D x 527 mm H[1] |
| Weight | — | 34 kg (75 lbs)[1] |
| Certification | — | CE, NRTL, S2, S8*, China RoHS, EU RoHS[1] |