Waferpedia

Comparison ledger

, Tokyo Semitsu Kogaku (TSK) UF200versusAD12

Accretech , Tokyo Semitsu Kogaku (TSK) UF200, SUSS MicroTec AD12, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
AD12SUSS MicroTec
OEMAccretechSUSS MicroTec
Category——
Wafer sizeWafer Equipment300mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech , Tokyo Semitsu Kogaku (TSK) UF200SUSS MicroTec AD12
Specifications
Wafer sizeWafer Equipment[1]300 mm[2]
Date of Manufacture1998[1]—
Currently Configured for200mm[1]—
Current Equipment StatusAvailable[1]—
Available dateCurrently Available[1]—
Equipment categoryProduction Wafer Prober[1]—
Operation—Manual[2]
Process type—Aqueous[2]
Capabilities—Puddle developing, Spray developing, Wafer cleaning[2]
Sources (2)Every fact above is drawn from these public sources
  1. [1]dealer listingwotol.com
  2. [2]hilpert.chhilpert.ch