Comparison ledger
Accretech UF 3000 Automatic Wafer, Teradyne ETS 200 T, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | UF 3000 Automatic WaferAccretech | ETS 200 TTeradyne |
|---|---|---|
| OEM | Accretech | Teradyne |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech UF 3000 | Teradyne ETS 200 |
| Specifications | ||
| Configuration | Hot Nickel Chuck[2] | With Electroglas EG 4090 & 4090 u+ Prober (8")[1] |
| Including | MO, HDD[2] | — |
| Voltage | 115 Vac[3] | — |
| Mitigation Spec (HF) | MHF 6000[4] | — |
| Card Holder Material | SUS[4] | — |
| Card Replacement | APC[4] | — |
| Chuck Surface | Kanigen[4] | — |
| Chuck Temp Range | -40℃～150℃[4] | — |
| Tester I/F | GPIB[4] | — |
| Loader Type | 1st[4] | — |
| CPU Type | Advme 7501[4] | — |
| Cleaning Unit Size | 280 x 160 Partially Cut[5] | — |
| Wafer size | 12 inch[10] | — |
| Chuck size | 300mm[3] | — |
| Power requirement | Single Phase, 115 Vac, 2 Wire + Ground[3] | — |
| Included configuration | Hot Nickel Chuck, Right Single Loader, Manipulator, Needle Cleaner (ceramic pad not included), FDD, USB, MO, HDD[2] | — |
| Manufacturer | Accretech / TSK[11] | — |
| Model | UF 3000[11] | — |
| Type | Automatic Wafer Prober[11] | — |
| Wafer Sizes | 8 inch, 12 inch[3] | — |
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