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Comparison ledger

11980 AversusMetaPulse 200 XCu Metal Film Measurement

Agilent 11980 A, Onto Innovation MetaPulse 200 XCu Metal Film Measurement, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
11980 AAgilent
OEMAgilentOnto Innovation
CategoryPrecision OpticsPrecision Optics
Wafer size—Wafer Mapping
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAgilent 11980 AOnto Innovation MetaPulse 200
Specifications
Wavelength Range1250-1600 nm[1]—
Configuration—Non copper tool; double path tool delay stage[2]
Cooling Water Required Minimum Flow—0.79 GPM (3.00 l/m)[2]
Min Temp—12 *C (54 *F, 285.00 *K)[2]
Max Temp—20 *C (68 *F, 293 *K)[2]
Wafer size—Wafer Mapping[2]
Controller Type—PC Controller[2]
External Cooling—Water Cooled[2]
Cooling Water Required—Minimum Flow: 0.79 GPM (3.00 l/m) Min Temp: 12 *C (54 *F, 285.00 *K) Max Temp: 20 *C (68 *F, 293 *K)[2]
Operating Air Pressure—14.00 PSI (96,534.20 N/sq m)[2]
Vacuum Required—0.98 in Hg (24.89 mm Hg)[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]inventory listing