Waferpedia

Comparison ledger

2600 G 3 HT IC MOCVD Reactorversus0020 23839 Part

Aixtron 2600 G 3 HT IC MOCVD Reactor, Applied Materials 0020 23839 Part, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 23839 PartApplied Materials
OEMAixtronApplied Materials
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAixtron AIX 2600Applied Materials 0020 23839 Part
Specifications
ConfigurationSoftware Version; AIXACT 7.4.1.9[1]Plate, Sensor Clamp, Hdpcvd Ultima +[3]
PLC3.12.1[1]—
ProcessInGaN MOCVD Epitaxy[1]—
Wafer6 x 6"[1]—
Metal organic SourcesTMIn x 3, TMGa x 2, TMAl x 1, CP2Mg x 1, Future x 3[1]—
Hydride SourcesNH3 x 3, 100 ppm SiH4 in AR x 2, Future x 2[1]—
Concentration MonitorsEpison4 x 3 for TMln, Epison 4 x 1 for TMAl[1]—
PurifiersEntegris Getters for NH3, H2 & N2[1]—
Heating SystemRF Coil with Trumpf Huttinger RF Generator BIG 120/50[1]—
Glove BoxMBraun Nitrogen Glovebox with Controller[1]—
Process PumpEbara ESA 70 W or ESA 80 W[1]—
DOR & Glove Box PumpsAdixen ACP-15(G) x 2[1]—
AbatementUnisem UN2000A-WHG (single or shared across 2 reactors)[1]—
Reactor ChillersTek-Temp Recirculating Closed Lop Chiller[1]—
OEMAixtron[1]—
Model2600 G 3 HT IC[1]—
CategoryDeposition[2]—
Tool typeMOCVD Reactor[1]—
Software versionAIXACT 7.4.1.9[1]—
Vacuum/exhaustCustom Built Exhaust System[2]—
Reactor chillerTek-Temp Recirculating Closed Lop Chiller[1]—
In-situ pyrometryavailable[1]—
Gas Foil Rotation (GFR)Individual GFR Control for Each Puck[1]—
Spare Channels23 Spare MFC Channels & 10 Spare Valve output Channels[1]—

Plan your fab

Building a Deposition process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing