Waferpedia

Comparison ledger

M Prep 3versus100R16

Allied High Tech M Prep 3, Strasbaugh 100R16, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
M Prep 3Allied High Tech
100R16Strasbaugh
OEMAllied High TechStrasbaugh
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAllied High Tech M Prep 3Strasbaugh 100R16
Specifications
ConfigurationParts Unit[1]—
OEMAllied High Tech[1]—
ModelM Prep 3[1]—
CategoryCMP[2]—
Tool typeGrinder / Polisher[1]—
Wafer size8 inch[1]—
type—1 spindle grinder/polisher[3]
drive system—DC drive system with 2 motors[3]
spindle RPM—1-180 RPM[3]
eccentric RPM—1-90 RPM[3]
controls—digital timer; air down switch; spindle and eccentric speed dials; air regulators[3]
capacity—16 inches[3]
spindle size—1-8 TPI[3]
overall dimensions—28 inches x 36 inches x 48 inches[3]
weight—500 lbs[3]
origin—made in the USA[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]excelltechnology.comexcelltechnology.com