Waferpedia

Comparison ledger

0010-03254 E ChuckversusPiXDRO LP 30 Inkjet

Applied Materials 0010-03254 E Chuck, SUSS MicroTec PiXDRO LP 30 Inkjet, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-03254 E ChuckApplied Materials
PiXDRO LP 30 InkjetSUSS MicroTec
OEMApplied MaterialsSUSS MicroTec
Category——
Wafer size——
Process node——
Introduced——
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Family—SUSS MicroTec PiXDRO
Specifications
Configuration—System accuracy < 5 µm (3σ)[1]
Temperature—Table temperature up to 50 °C[1]
System accuracy—< 5 µm (3σ)[1]
Printable area—327 × 227 mm (A4)[1]
Max substrate thickness—25 mm[1]
Table temperature—up to 50 °C[1]
Max motion speed—250 mm/s[1]
Sources (1)Every fact above is drawn from these public sources
  1. [1]inventory listing