Waferpedia

Comparison ledger

0010-03485 Magnet AssyversusAS 8

Applied Materials 0010-03485 Magnet Assy, SUSS MicroTec AS 8, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-03485 Magnet AssyApplied Materials
AS 8SUSS MicroTec
OEMApplied MaterialsSUSS MicroTec
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-03485 Magnet AssySUSS MicroTec AS 8
Specifications
ConfigurationWP AL 300mm PVD[1]—
OEMApplied Materials[1]—
Model0010-03485[1]—
DescriptionMAGNET ASSY, WP AL 300MM PVD[2]—
ProcessPVD[3]—
Wafer size300mm[4]—
VersionSpares[4]—
Part Number0010-03485[1]—
ManufacturerApplied Materials[1]—
Process TypePVD (Physical Vapor Deposition)[1]—
Application (Material)Aluminum (AL)[1]—
Wafer Diameter (associated)300 mm[1]—
Substrate size (round)—up to 200 mm[5]
Substrate size (square)—up to 6" edge length[5]
Dual-nozzle substrate sizes—Ø150 mm, Ø200 mm[5]
Single-nozzle substrate sizes—Ø3", Ø100 mm, Ø150 mm, Ø200 mm[5]
Z-axis adjustment range—up to 45 mm[5]
Nozzle adjustment range—67.5 mm to 107.5 mm[5]
Spray axis maximum velocity—500 mm/s[5]
Spray axis acceleration—up to 9 m/s²[5]
Chuck maximum rotation speed—1,000 rpm[5]
Heated chuck—optional[5]
Splash-ring design—included[5]
Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]layla-ec.comlayla-ec.com
  4. [4]fabsurplus.comfabsurplus.com
  5. [5]suss.comsuss.com