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Comparison ledger

0010-13622 RF Match forversusIonfab 300 Plus IBD

Applied Materials 0010-13622 RF Match for, Oxford Instruments Ionfab 300 Plus IBD, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-13622 RF Match forApplied Materials
Ionfab 300 Plus IBDOxford Instruments
OEMApplied MaterialsOxford Instruments
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-13622 RF Match forOxford Instruments Ionfab 300
Cited variants—
  • Ionfab 300 Plus IBD / IBE[1]
Specifications
ConfigurationHigh Efficiency HE RF Match-Bias[2]—
Model0010-13622[2]—
Product TypeRF Match for PVD (Physical Vapor Deposition)[2]—
FeatureHigh Efficiency HE RF Match-Bias[2]—
Contamination—II-VI[3]
No longer Functioning—Software, Automata[3]
Category—Deposition[4]
Family—Oxford Instruments Ionfab 300[4]
Process type (IBD/IBE configuration)—Ion beam deposition and ion beam etching[1]
Wafer size—6-inch to 8-inch wafers[1]
Wafer handling / throughput configuration—Loadlock and robot with secondary pumping; vacuum can remain inside for higher throughput[1]
Electrical supply—3 Phase[1]
Vintage—2013[3]
Functional status (as reported on one unit)—No longer functioning: Software, Automata[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com