Comparison ledger
Applied Materials 0010-13622 RF Match for, Plasma-Therm 790, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | 790Plasma-Therm |
|---|---|---|
| OEM | Applied Materials | Plasma-Therm |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Plasma-Therm 790 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[2] | — |
| Model | 0010-13622[2] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[2] | — |
| Feature | High Efficiency HE RF Match-Bias[2] | — |
| Tool name | — | PECVD 1 (PlasmaTherm 790)[3] |
| System type | — | open-load etch and deposition systems[1] |
| Series reference | — | formerly Plasma-Therm 790+ series[1] |
| Process type | — | PECVD[3] |
| Category | — | Chemical Vapor Deposition (CVD)[3] |
| Archived series reference | — | formerly Plasma-Therm 790+ series open-load etch and deposition systems[1] |
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