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0010-13627 High Efficiency RF MatchversusRaider ECD 312 Electroplating

Applied Materials 0010-13627 High Efficiency RF Match, Semitool Raider ECD 312 Electroplating, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsSemitool
CategoryLab & Support EquipmentLab & Support Equipment
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-13627 High Efficiency RF MatchSemitool Raider ECD
Specifications
ConfigurationHE, BIAS[1]50/60 Hz[2]
Asset Number70430[1]—
TypeHigh Efficiency RF Match - HE, BIAS[1]—
Phase—3 Phase[2]
Voltage—380 V[2]
Loadport—3 X FOUP[2]
PC—FUI[2]
Power Phase—3 Phase[2]
Frequency—50/60 Hz[2]
Wafer Handling Robot—Xfer Robot, 1x Linear Dual Arm with Edge Grip Endeffector[2]
Vacuum and Rinse—Vacuum prewet, 1 Stack SRD[2]
Chemical Tanks—11[2]
Chillers—4[2]
Controller—PC with FUI[2]
Chamber Components—Chamber lift assy, Spin motor, Push plate control board, Plate sylinder (2), Contact Ring (only ECD), Lip seal (only eCD), Flow pump (only eCD), Anode basket (only eCD)[2]
Tank Components—Tank body, Circulation pump, Filter housing, Heater housing, Level sensor (5), Tank remote board, Tank control block[2]
Vintage—2011[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing