Waferpedia

Comparison ledger

0010-16392 ESC Assemblyversus2300 Exelan Dielectric

Applied Materials 0010-16392 ESC Assembly, Lam Research 2300 Exelan Dielectric, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-16392 ESC AssemblyApplied Materials
OEMApplied MaterialsLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-16392 ESC AssemblyLam Research 2300 Exelan Dielectric
Specifications
OEMApplied Materials[1]—
Model0010-16392[1]—
TypeESC Assembly[1]—
Wafer Size300 mm[2]12 inch (300mm)[3]
Electrode ConfigurationDual[2]—
Process—Dielectric Etch[4]
Node Capability—sub-65 nm (validated for front- and backend)[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]spwindustrial.comspwindustrial.com
  3. [3]Equipment inventory listing
  4. [4]fabsurplus.comfabsurplus.com
  5. [5]newsroom.lamresearch.comnewsroom.lamresearch.com