Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, Applied Materials UVision 3, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | UVision 3Applied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | 2007– |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | Applied Materials UVision 3 |
| Specifications | ||
| Make | Applied Materials[1] | — |
| Model | 0010-22161[1] | — |
| Description | HTESC PH 1 REV A[2] | — |
| Condition | Used[2] | — |
| Stock Number | BM6628[2] | — |
| Type | — | DUV Brightfield wafer inspection tool[3] |
| Throughput improvement | — | 40% faster than any competitive brightfield inspection tool[3] |
| Defect sensitivity | — | 20 nm[3] |
| Laser architecture | — | Multi-beam DUV laser (triples the number of laser beams)[3] |
| Imaging modes | — | Two new imaging modes extending sensitivity to 20 nm[3] |
| Defect classification | — | Flexible automatic defect classification engine[3] |