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Comparison ledger

0010-22161 High EFF RF MatchversusMY 600 Jet

Applied Materials 0010-22161 High EFF RF Match, MyData MY 600 Jet, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsMyData
Category——
Wafer size——
Process node——
Introduced——
Production run—2014–
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-22161 High EFF RF MatchMyData MY 600 Jet
Specifications
MakeApplied Materials[1]—
Model0010-22161[1]MY 600 Jet[3]
DescriptionHTESC PH 1 REV A[2]—
ConditionUsed[2]—
Stock NumberBM6628[2]—
Manufacturer—MyData[3]
Equipment type—Printer[3]
Application—Stencil-free application of solder paste onto PCBs[4]
Throughput—More than one million dots per hour[4]
Platform description—Next-generation jetting platform[4]
Machine type—Printer[3]
Throughput increase versus previous models—50 percent increase[4]
Function—Stencil-free application of solder paste onto PCBs[4]
Throughput increase vs previous models—50 percent increase[4]
Vintage—2014[3]
Acceleration—3G[5]
Base weight—2000 kg casted granite[5]
Beam material—lightweight carbon fiber[5]
Motion system—direct drive motors with high-precision linear encoders[5]
Jetting technology—non-contact jetting nozzle, no z-axis movement[5]
Software—self-learning data preparation system, graphical editor, auto-match function[5]
Data input—CAD or Gerber data[5]
Changeover time—less than one minute[5]
Product type—Printer[3]
Operating mode—In-line or stand-alone[5]
Control platform—100% software-driven[5]
Sources (5)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]tarasemi.comtarasemi.com
  3. [3]Equipment inventory listing
  4. [4]mycronic.commycronic.com
  5. [5]as-equipment.deas-equipment.de