Comparison ledger
Applied Materials 0010 47763, Hitachi M 712 M 711 Dry Etch Process, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | M 712 M 711 Dry Etch ProcessHitachi |
|---|---|---|
| OEM | Applied Materials | Hitachi |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | Hitachi M 712 M 711 Dry Etch Process |
| Cited variants | — |
|
| Specifications | ||
| Configuration | 2nd Source New[2] | Gaspanel included[5] |
| Type | Monopolar Dual Heated[3] | — |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[4] | — |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[3] | — |
| Model | 0010-47763[2] | — |
| OEM | Applied Materials[2] | — |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[3] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[3] | — |
| Quantity available (source) | 1[3] | — |
| Software revision | — | 1.07 PMv.02.16M[5] |
| ESC Type | — | Bipolar[1] |
| Endpoint type | — | Hitachi EPD monitor ePMv02.16M[1] |
| Wafer size | — | 12 inch[5] |
| TMP | — | SHIMAZU EC TMP[1] |
| TMP controller | — | 3203LMC-K1 EC TMP Controller[1] |
| Source generator | — | DAIHEN ES7-IIA EC Source generator[1] |
| Bias generator | — | PEARL CF-500-400K EC Bias generator[1] |
| Gas configuration | — | Line / EC1 / Strip - 1 / Ar - 2 / C12 - 3 / SF6 - 4 / HBr - 5 / CF3 - 6 / CH4 - 7 / NF3 - 8 / O2 - 9 / N2 - 10/ SF6 - 11/ C12 - 12/ O2[1] |
| Gas panel included | — | Yes[5] |
| Vintage | — | 2006[5] |
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