Comparison ledger
Applied Materials 0010 47763, Lam Research 490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | 490Lam Research |
|---|---|---|
| OEM | Applied Materials | Lam Research |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | Lam Research 490 |
| Specifications | ||
| Configuration | 2nd Source New[1] | — |
| Type | Monopolar Dual Heated[2] | — |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3] | — |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Model | 0010-47763[1] | — |
| OEM | Applied Materials[1] | — |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[2] | — |
| Quantity available (source) | 1[2] | — |
| Tool type | — | Auto Etcher[4] |
| Process type | — | Plasma etcher[5] |
| Wafer size | — | 4"~6"[5] |
| Wafer size range | — | 3-inch to 6-inch wafers[6] |
| Wafer handling | — | Cassette-to-cassette automatic wafer handling[5] |
| Processing mode | — | Single-wafer processing[6] |
| Load lock | — | Vacuum load locked[6] |
| Control | — | Fully automated microprocessor control[6] |
| Electrode spacing | — | Programmable, variable electrode spacing[6] |
| Endpoint detection | — | Included[6] |
| Wafer size (typical) | — | 4"~6"[5] |
| Chamber architecture | — | Double airlock structure, vacuum load locked[5] |
| RF generator | — | Included[5] |
| Process gas control | — | Multiple process gas lines with MFC control[5] |
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