Waferpedia

Comparison ledger

0020 17485 PartversusEndura CL

Applied Materials 0020 17485 Part, Applied Materials Endura CL, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 17485 PartApplied Materials
Endura CLApplied Materials
OEMApplied MaterialsApplied Materials
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 17485 PartApplied Materials Endura
Cited variants—
Specifications
ConfigurationStrap, RF Out 2 Balanced Coil Match, Hdp[4]Preclean[1]
Phase—3 Phase[5]
Voltage—400V[5]
Chamber E—Degas[5]
Chamber F—Degas[5]
SUB Rack—BULE Distribution Rack[5]
Chamber—D (PC-XT), 1 (IMP), 2/3 (TxZ)[6]
OEM—Applied Materials[1]
Model—Endura CL[1]
Equipment type—Chamber[1]
Chamber configuration—Preclean[1]
Vintage—2002[1]
Make—Applied Materials[1]
Product detail—Preclean 2002 Vintage[1]

Plan your fab

Building a Deposition process? Get a complete equipment list.

Open the fab equipment planner →
Sources (8)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]inventory listing
  7. [7]inventory listing
  8. [8]Equipment inventory listing