Waferpedia

Comparison ledger

0020 18455 PartversusSEC-600

Applied Materials 0020 18455 Part, CHA SEC-600, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 18455 PartApplied Materials
OEMApplied MaterialsCHA
CategoryDepositionDeposition
Wafer size—6 in.
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 18455 PartCHA SEC-600
Specifications
ConfigurationShaft,Rf In Local Match, Hdpcvd,Rev3[1]—
System type—Sputtering System[2]
Wafer size—6 in.[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org