Comparison ledger
Applied Materials 0020 18455 Part, CHA SSC-600, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0020 18455 PartApplied Materials | SSC-600CHA |
|---|---|---|
| OEM | Applied Materials | CHA |
| Category | Deposition | Deposition |
| Wafer size | — | 6 in. system |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0020 18455 Part | CHA SSC-600 |
| Specifications | ||
| Configuration | Shaft,Rf In Local Match, Hdpcvd,Rev3[1] | — |
| System type | — | Sputtering System[2] |
| Wafer size | — | 6 in. system[2] |
| Operation | — | Sputter up or sputter down operations[2] |
| Baseplates | — | Upper and lower baseplates[2] |
| Cathodes | — | Up to four DC or RF cathodes[2] |
| Fixture | — | Single plane, multi substrate rotating fixture[2] |
| Control | — | Computer control[2] |
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