Waferpedia

Comparison ledger

0020 23839 PartversusP 5000 Mark II DLH Delta PECVD-TEOS

Applied Materials 0020 23839 Part, Applied Materials P 5000 Mark II DLH Delta PECVD-TEOS, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 23839 PartApplied Materials
OEMApplied MaterialsApplied Materials
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 23839 PartApplied Materials P 5000 Mark II DLH Delta PECVD-TEOS
Specifications
ConfigurationPlate, Sensor Clamp, Hdpcvd Ultima +[1]—
OEM—Applied Materials[2]
Model—P 5000 Mark II DLH Delta[2]
Wafer Sizes—6 inch[2]
Process—PECVD-TEOS (Plasma-Enhanced Chemical Vapor Deposition - Tetraethyl Orthosilicate)[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing