Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, SUSS MicroTec FC 150 Flip Chip, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | FC 150 Flip ChipSUSS MicroTec |
|---|---|---|
| OEM | Applied Materials | SUSS MicroTec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | SUSS MicroTec FC 150 Flip Chip |
| Specifications | ||
| Configuration | — | 100 kg Bond Pressure[1] |
| Voltage | — | 220V, 60Hz[3] |
| Frequency | — | 50 Hz[5] |
| Bond Pressure | — | 50 kg, 100 kg, 200 kg[1] |
| Electrical Requirements | — | 20 Amps, 220V, 60Hz[3] |
| Heating Chuck Size | — | 100 mm[2] |
| Universal Bonding Arm (UBA) | — | 100 mm[2] |
| Automatic Alignment | — | Yes[2] |
| Process Recording | — | Yes[2] |
| Chip and Substrate Cassettes | — | 4 inch[2] |
| Chip Flipper | — | Optional[4] |
| Automatic Alignment (Cognex 8000) | — | Optional[4] |
| Advanced Laser Leveling | — | Optional[4] |
| High Precision SET Reflow Arm (SRA) | — | Optional[4] |
| Force Sensor in Stage | — | Optional[4] |
| Cassette Size | — | 4 inch (100 mm)[2] |
| Heating UBA | — | 100 mm, 200 kg[2] |
| Optional: Chip Flipper | — | Available[4] |
| Optional: Advanced Laser Leveling | — | Available[4] |
| Optional: Universal Bonding Arm (UBA) | — | Available[4] |
| Optional: High Precision SET Reflow Arm (SRA) | — | Available[4] |
| Optional: Force Sensor in Stage | — | Available[4] |
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