Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, SUSS MicroTec SB 6, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | SB 6SUSS MicroTec |
|---|---|---|
| OEM | Applied Materials | SUSS MicroTec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | Wafer bonding at pressures 5e-5 to 3e-3 Torr and 50*C to 550*C |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | SUSS MicroTec SB 6 |
| Cited variants | — | |
| Specifications | ||
| Configuration | — | Pneumatic Block replaced with a SMC Solenoid Block[3] |
| Wafer size | — | Wafer bonding at pressures 5e-5 to 3e-3 Torr and 50*C to 550*C[3] |
| Temperature range | — | 50°C to 550°C[4] |
| Vacuum pressure | — | 5e-5 to 3e-3 Torr[3] |
| Base pressure | — | <5x10^-5 mbar[1] |
| Process pressure range (source 3) | — | 5e-5 to 3e3 mBar[4] |
| Maximum force | — | 20 kN[4] |
| Anodic bonding voltage | — | up to 2000 V[4] |
| Temperature accuracy | — | +/- 5 degrees[4] |
| Temperature uniformity | — | +/- 3%[4] |
| Heating | — | Upper and lower heating[4] |
| Control system | — | Windows-based computer control[4] |
| Bond head size | — | 150 mm[1] |
| Substrate sizes supported | — | 100 mm wafers, 3 inch wafers, small pieces[1] |
| Compatible bonding processes | — | Adhesive, Anodic, Eutectic, Fusion, Glass frit, Thermal compression[1] |
| Wafer Size | — | 6 inch (150 mm)[3] |
| Bonding Pressure Range | — | 5e-5 to 3e-3 Torr[3] |
| Achievable Chamber Pressure | — | < 5x10^-5 mbar[1] |
| Supported Bonding Processes | — | Adhesive, Anodic, Eutectic, Fusion, Glass frit[1] |
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