Waferpedia

Comparison ledger

0720 06060 PartversusOpus 3 SLT

Applied Materials 0720 06060 Part, Semics Opus 3 SLT, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0720 06060 PartApplied Materials
OEMApplied MaterialsSemics
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0720 06060 PartSemics Opus 3 SLT
Specifications
ConfigurationContact Pin 24-20 Awg Crimp Gold Flash[1]—
Type—Automatic[2]
Accuracy—1.5 µm[2]
Chuck size—175 x 200 mm[2]
Operating temperature—-40 to 200 °C[2]
Probing force—230 kgf[2]
Overall dimensions—1485 x 1720 x 960 mm[2]
Wafer size—8 inches, 12 inches[2]
Test temperature range—-55 °C to 200 °C[3]
Test temperature accuracy—±1 °C[3]
Chuck load capacity—200 kg[3]
Wafer Sizes Supported—8 inches, 12 inches[3]
Test Temperature Range (Alternative)—-40 °C to 200 °C[2]
System Overall Accuracy—±1.5 µm[3]
System Overall Accuracy (Alternative)—1.5 µm[2]
Chuck Flatness—within 15 µm[3]
Die Size Range—0.2 mm to 100 mm[3]
Acceptable Wafer Bow—2 mm for 8-inch and 12-inch wafers[3]
MTBF—> 180 hours[3]
OCR Image Recognition and Auto Needle Alignment—Yes (upward-looking camera, fully automatic)[3]
GPIB Communication—Yes[3]
Mapping Format Compatibility—TSK, TEL, OPUS[3]
Cleaning Modes—CLEAN PAD (100 mm x 200 mm), CLEAN WAFER (8 & 12 inch)[3]
Remote Control—TeamViewer, VNC[3]
Manufacturer—Semics Inc.[3]
Model—Opus 3 SLT[4]
Operating Temperature—-40 to 200 Degree C[2]
Equipment Name—高低温全自动探针台-Opus 3 SLT[3]
Instrument Number—22007413[3]
Origin—Korea[3]
Temperature Range—-55℃~200℃[3]
Temperature Accuracy—±1℃[3]
System Accuracy—±1.5 um[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semiconductor.directorysemiconductor.directory
  3. [3]antpedia.comantpedia.com
  4. [4]Equipment inventory listing