Comparison ledger
Applied Materials 0720 06060 Part, Teradyne Nextest Magnum II X SSV, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0720 06060 PartApplied Materials | Nextest Magnum II X SSVTeradyne |
|---|---|---|
| OEM | Applied Materials | Teradyne |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0720 06060 Part | Teradyne Nextest Magnum |
| Specifications | ||
| Configuration | Contact Pin 24-20 Awg Crimp Gold Flash[1] | HSB 3 (qty 16)[2] |
| Test head | — | 4 Chassis[2] |
| DBM Size | — | 18(2) GBIT[2] |
| ECRM Size | — | 72(4) GBIT[2] |
| RCM Size | — | 36(2) Mbit[2] |
| Test head chassis | — | 4[2] |
| HSB 3 quantity | — | 16[2] |
| PE63 quantity | — | 64[2] |
| DP3X quantity | — | 64[2] |
| IPC quantity | — | 4[2] |
| Total channels | — | 4096[2] |
| DPO quantity | — | 4[2] |
| Tester computer | — | Dell T3500[2] |
| Operating system | — | Windows Server 2003[2] |
| Make | — | Teradyne / Nextest[3] |
| Model | — | Magnum II X SSV[3] |
| HSB | — | 3 (qty 16)[2] |
| PE63 | — | (qty 64)[2] |
| DP3X | — | (qty 64)[2] |
| IPC | — | (qty 4)[2] |
| DPO | — | (qty 4)[2] |
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