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Comparison ledger

DPS II CIPversus1512e

Applied Materials DPS II CIP, Tegal 1512e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
DPS II CIPApplied Materials
1512eTegal
OEMApplied MaterialsTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials DPSTegal 1512e
Specifications
Configuration4x (D4) SILICON DPS II chamber, 12 Gas line (Standard Gas Line)[1]—
Applicable2 Chiller[1]—
Not applicableScrubber, Dry Pump[1]—
OEMApplied Materials[1]—
ModelDPS II CIP[1]—
CategoryEtch[2]—
Tool typeEtcher[2]Industrial RIE plasma etcher system[3]
Chamber4x (D4) SILICON DPS II chamber[1]—
Gas line12 Gas line (Standard Gas Line)[1]—
Chiller2 Chiller applicable[1]—
ScrubberNot applicable[1]—
Dry pumpNot applicable[1]—
Vintage2005[1]—
Stated configuration—With modules assembly for CI-4222[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]semistarcorp.comsemistarcorp.com