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Comparison ledger

Mirra 3400 Wversus12 Benchtop Lapping Polishing

Applied Materials Mirra 3400 W, Lapmaster 12 Benchtop Lapping Polishing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Mirra 3400 WApplied Materials
OEMApplied MaterialsLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials Mirra 3400 WLapmaster 12 Benchtop Lapping Polishing
Specifications
Wafer Size8 inch[1]—
Vintage Year1999[1]—
Make—Lapmaster[2]
Model—12[2]
Category—CMP[3]
Type/Application—Single sided[4]
Plate diameter—12 in[4]
No. of conditioning rings—3[5]
Configuration—Ring lapper[5]
Base—Rigid, lightweight, cast aluminum base[5]
Standard RPM—60 RPM[5]
RPM range with variable speed drive—0-60[5]
Drive motor - lapper—0.5 HP[5]
Drive motor - polisher—0.75 HP[5]
Length—25 in[5]
Width—18 in[5]
Height—24 in[5]
Estimated shipping weight—240 lbs[5]
Approximate weight—135 lbs / 61 kg[6]
Approximate dimensions—24.5 in × 17.5 in × 23.8 in (622 mm × 445 mm × 607 mm)[6]
Electrical system—Various voltages; 50/60 Hz; 1 phase and 3 phase to customer specification[6]
Motor—1/3 hp / 0.25 kW motor with gear reducer[6]
Abrasive feed system—Designed for water or oil based lapping slurries[6]
Automatic cycle timer—Automatic digital cycle timer[6]
Ring configuration—Ring lapper[5]
Ring ID—4.25 inches[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]lapmaster-wolters.comlapmaster-wolters.com
  5. [5]catalog.lapmaster.comcatalog.lapmaster.com
  6. [6]lapmaster-wolters.comlapmaster-wolters.com