Comparison ledger
Applied Materials Mirra Mesa CMP 5201, PR Hoffman 108T, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Mirra Mesa CMP 5201Applied Materials | 108TPR Hoffman |
|---|---|---|
| OEM | Applied Materials | PR Hoffman |
| Category | CMP | CMP |
| Wafer size | Wafer loss sensor | up to 12 in wafers |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Mirra Mesa | PR Hoffman 108T |
| Specifications | ||
| Configuration | Oxide, W[1] | — |
| Cassette | 25 slots[1] | — |
| Tower Lamp | 4 colors[1] | — |
| Cross Arm | side to side on robot plate, 270±0.1*[1] | — |
| Motor | Yaskawa[1] | — |
| Wafer size | Wafer loss sensor[1] | — |
| OEM | Applied Materials[1] | — |
| Model | Mirra Mesa CMP 5201[1] | — |
| Equipment type | Polisher[1] | — |
| Process configuration | Oxide, Dry In / Dry Out[1] | — |
| Cassette type | Open type cassette / 4 ports[1] | — |
| Cassette capacity | 25 slots[1] | — |
| Wafer loss sensor | Present[1] | — |
| HCLU platen size | 20 inch (3)[1] | — |
| Platen motor | Yaskawa (3)[1] | — |
| Platen speed | 1,2,3 ±5% (10–150 rpm)[1] | — |
| Platen temperature control | Present[1] | — |
| Dual wafer loss sensor with temp monitoring | Present (4)[1] | — |
| ISRM module type | Present (3)[1] | — |
| Upper platen coating | Teflon coating (3)[1] | — |
| Polish head size | 8 inch (4)[1] | — |
| Polish head rotation motor | NSK motor (4)[1] | — |
| Polish head speed | ±5% (10–120 rpm)[1] | — |
| Polish head vacuum | Membrane vacuum ±10%, upgraded vacuum eject system[1] | — |
| Polish head action | Programmable & auto action for heads 1–4[1] | — |
| Water fall type | Configured[1] | — |
| Rotary union | 3 port / zone type[1] | — |
| Head sweep | Standard head sweep, oriental motor[1] | — |
| Pad conditioner | 1 per platen (3), screw type, universal disk holder[1] | — |
| Slurry arm | Dual line output type delivery (3)[1] | — |
| Polisher lower | Malema flow meter type (6)[1] | — |
| Rotation motor | NSK motor (4)[1] | — |
| Head 1,2,3,4 speed | ±5%(10~120 rpm)[1] | — |
| carrier type listing | — | 108T 9B - S/F / Lapmaster LSP-9 / etc.[2] |
| machine class | — | for double-sided planetary lapping & polishing machines[2] |
| wafer sizes stated on insert-carrier page | — | 3 in, 4 in, 5 in, 6 in, 8 in, and 12 in wafers[2] |
| maximum carrier diameter stated on insert-carrier page | — | up to 33 in diameter[2] |
| maximum carrier diameter stated on lapping-carrier page | — | up to 48 in diameter[3] |