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Comparison ledger

AS 899versus10490

ASM AS 899, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10490West Bond
OEMASMWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASM AS 899West Bond 10490
Cited variants
  • AS 899 Die Bonder[1]
  • AS 899 Test & Sort[2]
—
Specifications
CategoryPackaging & Bonding[3]—
Frequency50/60 Hz[2]—
Voltage230 Vac[2]—
Phase1 Phase[2]—
Manufacture year2014[2]—
Manufacturer—West Bond[4]
Model—10490[4]
Description—Convertible bonder, wedge to ball[5]
Tool type—Convertible bonder[6]
Bonding modes—Wedge bonding and ball bonding[6]
Use—Wire bonding[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]waferpedia.comwaferpedia.com
  4. [4]Equipment inventory listing
  5. [5]fabsurplus.comfabsurplus.com
  6. [6]waferpedia.comwaferpedia.com