Comparison ledger
ASM Eagle Aero, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Eagle AeroASM | 10100West Bond |
|---|---|---|
| OEM | ASM | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASM Eagle Aero | West Bond 10100 |
| Cited variants |
| — |
| Specifications | ||
| Voltage | 110 VAC[2] | — |
| Configuration | Single phase[2] | — |
| Equipment Type | Automatic ball wire bonding system[3] | — |
| Bonding Technology | Thermosonic with X-Power[1] | — |
| Transducer | Aeroducer dual frequency (X and Y direction)[1] | — |
| Bonded Ball Size | 22 µm[1] | — |
| Wire Size | 0.5 mil[1] | — |
| UPH Improvement | Up to 30% for typical Cu wire application[1] | — |
| Wire Materials | Copper wire, gold wire and compatible materials[3] | — |
| Application | High-end IC semiconductor packaging[1] | — |
| Power Requirements | 110 VAC, Single phase, 50/60Hz[2] | — |
| Optical System | Dual magnification optical path, dual-color coaxial light[4] | — |
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