Waferpedia

Comparison ledger

Eagle Xtremeversus10490

ASM Eagle Xtreme, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10490West Bond
OEMASMWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASM EagleWest Bond 10490
Specifications
ConfigurationLast used to bond thin gold wire with diameter of 50um or 2 mils. But software can be changed to other configurations.[1]—
Manufacturer—West Bond[2]
Model—10490[2]
Description—Convertible bonder, wedge to ball[3]
Tool type—Convertible bonder[4]
Bonding modes—Wedge bonding and ball bonding[4]
Use—Wire bonding[4]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]fabsurplus.comfabsurplus.com
  4. [4]waferpedia.comwaferpedia.com