Comparison ledger
ASM Epsilon 2000, Temescal UEFC-4900, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Epsilon 2000ASM | UEFC-4900Temescal |
|---|---|---|
| OEM | ASM | Temescal |
| Category | Deposition | Deposition |
| Wafer size | 150mm | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASM Epsilon | Temescal UEFC-4900 |
| Specifications | ||
| Supply Voltage/ Freq | 480/ 50[1] | — |
| System Hand | Right Hand[1] | — |
| Monitor Type | Flat Panel[1] | — |
| Wafer Size | 150mm[1] | — |
| Maint Console | Mini Maint[1] | — |
| CPU | 68040[1] | — |
| Software Version | 7.65[1] | — |
| Comms | HSMS[1] | — |
| RP/ ATM | RP[1] | — |
| Vacuum Load Locks | No[1] | — |
| WHC Gate Valve | Swing[1] | — |
| WHC Robot Arm | Wide[1] | — |
| Reactor Isolation | HVA[1] | — |
| ATM Valve | VAT[1] | — |
| Pressure Controller | MKS 152 Analogue[1] | — |
| PCV Type | MKS 253B[1] | — |
| Choke Valve | Yes[1] | — |
| RP Orientation | Bottom Feed[1] | — |
| Gas Panel Orientation | Top Feed[1] | — |
| Main H2/N2 | 100slm[1] | — |
| Process type | CVD (Chemical Vapor Deposition)[1] | — |
| Wafer sizes supported | 150 mm and 200 mm wafers[3] | — |
| Tool type | single-wafer epitaxy tool[3] | — |
| Supply voltage/frequency | 480/50[1] | — |
| Source listing | — | Temescal UEFC-4900 is named in the Temescal systems navigation/lineup[4] |
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