Waferpedia

Comparison ledger

200 ACUversus2300 Exelan Dielectric

Axcelis 200 ACU, Lam Research 2300 Exelan Dielectric, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
OEMAxcelisLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Lam Research 2300 Exelan Dielectric
Specifications
ConfigurationParts Machine[1]—
ManufacturerAxcelis[1]—
Model200 ACU[1]—
Tool typeAsher[1]—
Wafer size200mm[3]—
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]—
Wafer configuration8 inch[2]—
Wafer Size—12 inch (300mm)[5]
Process—Dielectric Etch[6]
Node Capability—sub-65 nm (validated for front- and backend)[7]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (7)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]Equipment inventory listing
  6. [6]fabsurplus.comfabsurplus.com
  7. [7]newsroom.lamresearch.comnewsroom.lamresearch.com