Waferpedia

Comparison ledger

200 ACUversusTLUDRM Dry

Axcelis 200 ACU, Tokyo Electron TLUDRM Dry, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
TLUDRM DryTokyo Electron
OEMAxcelisTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Tokyo Electron TLUDRM Dry
Specifications
ConfigurationParts Machine[1]—
ManufacturerAxcelis[1]—
Model200 ACU[1]TLUDRM Dry[5]
Tool typeAsher[1]—
Wafer size200mm[3]—
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]Dry Etcher[5]
Wafer configuration8 inch[2]—
OEM—Tokyo Electron[5]
Asset number—73367[5]
Make—Tel[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]Equipment inventory listing