Waferpedia

Comparison ledger

RapidCure 320 FC RPCversus1088

Axcelis RapidCure 320 FC RPC, Heller 1088, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1088Heller
OEMAxcelisHeller
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis RapidCure 320 FC RPCHeller 1088
Specifications
Heating Zones—8 zones (4 top and 4 below) plus 1 cooling zone[1]
Heating Method—Forced convection[1]
Conveyor Width—18 inches (45 cm)[1]
Heated Length—43.5 inches (111 cm)[1]
Overall Length—96 inches (244 cm)[1]
Height—50 inches (127 cm)[1]
Net Weight—900 lbs (409 kg)[1]
Thermal Profiler—Included[1]
Oven Top—Counter balance for easy access to conveyor[1]
Solder Compatibility—Lead-free and leaded soldering[1]

Plan your fab

Building a Thermal / Diffusion process? Get a complete equipment list.

Open the fab equipment planner →
Sources (1)Every fact above is drawn from these public sources
  1. [1]smtdevices.comsmtdevices.com