Waferpedia

Comparison ledger

18 D SurfaceversusCS30

Blanchard 18 D Surface, Logitech CS30, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
CS30Logitech
OEMBlanchardLogitech
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceLogitech CS30
Specifications
Voltage416 V[1]—
Phase3 Phase[1]—
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[1]—
Model18 D[1]—
Asset #153970[1]—
Power416 V, 3 phase[1]—
Motor—240/110V, 50/60Hz; 0.25kw belt drive[3]
Blade—200mm diameter; 1.5mm thick; 22mm arbor; 1800 r.p.m[3]
Slide Size—2 of 28 x 48mm/26 x 46mm or 1 of 26 x 76mm[3]
Dimensions—530 x 240 x 300mm[3]
Net Weight—30kg[3]
Blade diameter—200mm[3]
Blade thickness—1.5mm[3]
Blade arbor—22mm[3]
Blade speed—1800 r.p.m[3]
Slide size capacity—2 of 28 x 48mm/26 x 46mm or 1 of 26 x 76mm[3]
Dimensions (W x D x H)—530 x 240 x 300mm[3]
Minimum specimen thickness (trimming)—500 µm[3]
Machine type—Compact trim saw[3]
Application—Thin section preparation[3]
Minimum trimming thickness—500 µm[3]
Chuck—Ceramic vacuum chuck[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]web.archive.orgweb.archive.org