Waferpedia

Comparison ledger

20 36 SurfaceversusDTG 8460 Taiko

Blanchard 20 36 Surface, Disco DTG 8460 Taiko, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceDisco DTG 8460
Cited variants—
  • DTG 8460 Wafer Backside[1]
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[2]3 Chucks[3]
Magnetic Chuck ControlElectro-Matic Neutrol II[2]—
Phase—200-2008 V, 50 A, 50/60 Hz, 3 Phase[3]
Voltage—208 V[4]
Wafer size—12 inch[3]
Process type—Cassette to Cassette[3]
Number of chucks—3[3]
Current—50 A[3]
Frequency—50/60 Hz[3]
Add-on chiller—DTU 1531[3]
Accessories—USV, Duct Unit, Vacuum Unit[3]
Vintage year—2012[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com
  5. [5]tarasemi.comtarasemi.com