Waferpedia

Comparison ledger

101-149-053 Gold BoosterversusUTC 1000

Branson 101-149-053 Gold Booster, Shinkawa UTC 1000, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
UTC 1000Shinkawa
OEMBransonShinkawa
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—2005 Vintage
Control system——
Generation——
FamilyBranson 101-149-053 Gold BoosterShinkawa UTC
Specifications
Configuration1:1.5[1]Pattern Recognition Unit:[4]
ManufacturerBranson[2]—
Model101-149-053[2]—
TypeGold Booster[2]—
Operating frequency20 kHz[3]—
Gain1:1.5[2]—
Mounting thread1/2-20[3]—
Length5.4 in[3]95 ~ 262 mm[4]
Gain ratio1:1.5[2]—
Bonding Method—Ultrasonic Thermo Compression[4]
Machine Accuracy—+/- 2.5 µm (+/- 3.3 µm for multi-bonding setting)[4]
Bonding Speed—67 ms / 2 mm Wire (With Loop Control)[4]
Bonding Wire Length—Max. 8 mm[4]
Number of Bonding Wires—8000 Wires[4]
Loader / Unloader—Magazine Stacker Type[4]
Indexer—Center-Parting Type Universal Indexer[4]
Power Supply—AC 100 V +/- 5 % 50/60 Hz[4]
Power Consumption—Approx. 1000 W[4]
Compressed Air—500 kPa {5 kgf / cm²} 60 I / min[4]
Vacuum pressure—-74 kPa (-550 mmHg) or less (Gauge Pressure)[4]
Dimensions & Mass—1080 W x 950 D x 1940 H mm , Approx. 590 kg[4]
Detection Method—Gray Scale Correlation[4]
Detection Speed—0.11 s Max,. / 2 Point Alignment (including move time)[4]
Lead Side—MAx. X: +/- 1.26 mm, Y: +/- 0.86 mm[4]
Die Side—Max. X: +/- 0.31 mm, Y: +/- 0.21 mm[4]
Bonding Area—X: +/- 28 mm, Y: +/- 33 mm[4]
Machine Accuracy (single bond)—±2.5 µm[4]
Machine Accuracy (multi-bonding)—±3.3 µm[4]
Max Bonding Wire Length—8 mm[4]
Loader/Unloader Type—Magazine Stacker Type[4]
Indexer Type—Center-Parting Type Universal Indexer[4]
Dimensions (W x D x H)—1080 x 950 x 1940 mm[4]
Mass—Approx. 590 kg[4]
Pattern Recognition Detection Method—Gray Scale Correlation[4]
Pattern Recognition Detection Speed—0.11 s max for 2-point alignment (including move time)[4]
Detection Area (Lead Side)—Max X: ±1.26 mm, Y: ±0.86 mm[4]
Detection Area (Die Side)—Max X: ±0.31 mm, Y: ±0.21 mm[4]
Wire Diameter (Gold Wire)—Ø15–38 µm, 2-inch double flange spool[4]
Applicable Lead Frame Width—20–80 mm[4]
Applicable Lead Frame Length—95–262 mm[4]
Applicable Lead Frame Thickness—0.07–0.3 mm[4]
Gold Wire—Ø 15 ~ 38 µm[4]
Width—20 ~ 80 mm[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]nextdayautomation.comnextdayautomation.com
  4. [4]inventory listing
  5. [5]inventory listing