Waferpedia

Comparison ledger

100versus661 HT

CEE 100, SVG 661 HT, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100CEE
OEMCEESVG
CategoryLithographyLithography
Wafer size6"Mask / Wafer Handling:
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 100SVG 661 HT
Cited variants—
Specifications
Tool typeSpray Developer[1]—
Accepts wafer sizeup to 6" wafers[2]—
Programmable programs10 programs[2]—
Steps per programup to 10 steps[2]—
Programmable step parametersAcceleration, Speed, Time[2]—
Associated documentCEE Model 100CB Spinner.doc[2]—
Wafer sizeUp to 6 inches[2]Mask / Wafer Handling:[3]
Programs10 programs each with up to 10 steps[2]—
Control parametersAcceleration, Speed, Time[2]—
Configuration—Refurbished in 2022[3]
Process—Photo Exposure[3]
Heat Exchanger / Chiller—Blower[3]
OEM—SVG[3]
Model—661 HT[3]
Equipment type—Aligner[3]
Category—Lithography[4]
Optics—High Throughput Coated Optics (HT)[3]
Performance—Integrated Uniformity Tester[3]
Software—OS 2000 Hardware and Software v29.x or Higher[3]
Host link—SEMI-GEM E 30 & HSMS # 37 Compliant Host Link[3]
Chamber Type—M 500 / 600[3]
Cassette Stage—150 mm no smf[3]
Wafer Mapping—Optical Sensor[3]
Control System—OS 2000[3]
Air Cooler—39,000 BTU 220 Vac 3 Ф[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]nanofab.ece.cmu.edunanofab.ece.cmu.edu
  2. [2]nanofab.utah.edunanofab.utah.edu
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com