Comparison ledger
CEE 1000 Hot Plate, Vitronics Soltec MyReflow 7038, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Soltec MyReflow 7038Vitronics | |
|---|---|---|
| OEM | CEE | Vitronics |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 1000 Hot Plate | Vitronics Soltec |
| Specifications | ||
| Configuration | 4"[1] | 9 + 3 Zones[2] |
| Type | Hot Plate[1] | Reflow soldering system[3] |
| Wafer Size | 4 inch[1] | — |
| Transport | — | Pin chain transport[3] |
| Atmosphere | — | Nitrogen[3] |
| Heating zones | — | 10[3] |
| Cooling zones | — | 4[3] |
| Pin length | — | 5 mm[3] |
| Pin distance | — | 19 mm[3] |
| N2 pressure | — | 6 bar[3] |
| PCB width | — | 50 mm - 508 mm[3] |
| Maximum component height | — | 40 mm / 30 mm (top / bottom)[3] |
| Transportation height | — | 832 - 914 mm[3] |
| Width adjustment | — | Electrical[3] |
| Software version | — | 4.0.6.b[3] |
| Construction year | — | 2015[3] |
| Year | — | 2004[4] |
Plan your fab
Building a Thermal / Diffusion process? Get a complete equipment list.
Open the fab equipment planner →