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Comparison ledger

3220versusDFD 651 Automatic Dicing

Disco 3220, Disco DFD 651 Automatic Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
3220Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 3220Disco DFD
Specifications
equipment typedicing saw[1]—
Workplace sizeø150 mm[2]—
Spindle layoutSingle[2]—
Spindle output1.5 kW at 30,000 min-1[2]—
Spindle max revolution speed40,000 min-1[2]—
X-axis feed speed range0.1 – 500 mm/s[2]—
Y-axis index step0.0001 mm[2]—
Z-axis repeating accuracy0.001 mm[2]—
Z-axis max blade sizeø58 mm[2]—
Configuration—Non-operational[3]
Type—Automatic Dicing Saw[3]
Wafer Sizes—6 inch, 8 inch[4]
Spindle—Dual 1000W Synchro Spindle[5]
Alignment—Macro/Micro Automatic Alignment[5]
Cleaning Unit—High Pressure Spinner Cleaning Unit[5]
Setup—Non Contact Setup[5]
Broken Blade Detector—Yes[5]
Theta—Motorized 360°[5]
Monitor—12-inch Monitor with Camera[5]
Chuck Table—8-inch Universal Chuck Table[5]
BBD and NCS—Yes[6]
Chuck—8-inch Porous Chuck[6]
Product type—Automatic Dicing Saw[3]
Make—Disco[3]
Model—DFD 651[3]
Operation—Automatic[3]
Wafer size—6, 8 inch[4]
OEM—Disco[3]
Equipment type—Automatic dicing saw[3]
Vintage—1999[4]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]inventory listing
  4. [4]Equipment inventory listing
  5. [5]gtsaz.comgtsaz.com
  6. [6]classoneequipment.comclassoneequipment.com