Waferpedia

Comparison ledger

3220versus7100 AD

Disco 3220, Kulicke & Soffa 7100 AD, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
3220Disco
7100 ADKulicke & Soffa
OEMDiscoKulicke & Soffa
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 3220Kulicke & Soffa 7100 AD
Cited variants—
Specifications
equipment typedicing saw[2]—
Workplace sizeø150 mm[3]—
Spindle layoutSingle[3]—
Spindle output1.5 kW at 30,000 min-1[3]—
Spindle max revolution speed40,000 min-1[3]—
X-axis feed speed range0.1 – 500 mm/s[3]—
Y-axis index step0.0001 mm[3]—
Z-axis repeating accuracy0.001 mm[3]—
Z-axis max blade sizeø58 mm[3]—
VAC—200-240[4]
Configuration—50/60Hz,15Amps[4]
Power—VA 3500[4]
Voltage—200-240 VAC[4]
Frequency—50/60 Hz[4]
Current—15 Amps[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]semistarcorp.comsemistarcorp.com
  2. [2]nanofab.utah.edunanofab.utah.edu
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]inventory listing