Comparison ledger
Disco DAD321, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DAD321Disco | 15Lapmaster |
|---|---|---|
| OEM | Disco | Lapmaster |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | 100mm | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAD321 | Lapmaster 15 |
| Specifications | ||
| Machine type | Automatic dicing saw[1] | — |
| Wafer size | 100 mm, 150 mm[1] | — |
| Supported wafer materials | Silicon, glass and pyrex wafers[1] | — |
| Other materials | Other materials on demand[1] | — |
| Maximum thickness on silicon | 1 mm[1] | — |
| Maximum thickness on glass and pyrex | 2.4 mm[1] | — |
| Max wafer size | 6 inches[2] | — |
| Wafer type | All shapes and sizes[2] | — |
| Max wafer thickness | 2 mm[2] | — |
| Max blade speed | 30,000 rpm[2] | — |
| Max feed speed | 2 mm/sec[2] | — |
| Tape thickness | 70 μm[2] | — |
| Max thickness (silicon) | 1 mm[1] | — |
| Max thickness (glass/pyrex) | 2.4 mm[1] | — |
| Input Power | — | 110 Vac[3] |
| Plate Diameter | — | 15 inches (381 mm)[4] |
| Number of Conditioning Rings | — | 3[4] |
| Ring ID | — | 5.5 inches (140 mm)[4] |
| Standard RPM | — | 60[4] |
| RPM Range (Variable Speed Drive) | — | 0-60[4] |
| Drive Motor - Lapper | — | 0.5 HP (0.37 kW)[4] |
| Drive Motor - Polisher | — | 0.75 HP (0.56 kW)[4] |
| Length | — | 25 inches (635 mm)[4] |
| Width | — | 20 inches (508 mm)[4] |
| Height | — | 24 inches (610 mm)[4] |
| Estimated Shipping Weight | — | 285 lbs (129.3 kg)[4] |
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