Comparison ledger
Disco DAD321, Logitech APD1, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DAD321Disco | APD1Logitech |
|---|---|---|
| OEM | Disco | Logitech |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | 100mm | 100mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAD321 | Logitech APD1 |
| Specifications | ||
| Machine type | Automatic dicing saw[1] | — |
| Wafer size | 100 mm, 150 mm[1] | — |
| Supported wafer materials | Silicon, glass and pyrex wafers[1] | — |
| Other materials | Other materials on demand[1] | — |
| Maximum thickness on silicon | 1 mm[1] | — |
| Maximum thickness on glass and pyrex | 2.4 mm[1] | — |
| Max wafer size | 6 inches[2] | — |
| Wafer type | All shapes and sizes[2] | — |
| Max wafer thickness | 2 mm[2] | — |
| Max blade speed | 30,000 rpm[2] | — |
| Max feed speed | 2 mm/sec[2] | — |
| Tape thickness | 70 μm[2] | — |
| Max thickness (silicon) | 1 mm[1] | — |
| Max thickness (glass/pyrex) | 2.4 mm[1] | — |
| Power supply | — | 220/240V, 50Hz[3] |
| Main drive motor | — | 230Vac 0.75kW[3] |
| Height | — | 720mm[3] |
| Width | — | 600mm[3] |
| Depth | — | 765mm[3] |
| Max depth of cut, annular mode | — | 55mm[3] |
| Max depth of cut, peripheral mode | — | 100mm[3] |
| Min drum speed | — | 100rpm[3] |
| Max drum speed, annular mode | — | 3000rpm[3] |
| Max drum speed, peripheral mode | — | 5000rpm[3] |
| Min feed rate | — | 0.01mm/sec[3] |
| Max feed rate | — | 2.0mm/sec[3] |
| Positional accuracy | — | 5 microns[3] |
| Coolant tank capacity | — | 15 litre capacity[3] |
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