Comparison ledger
Disco DAD3240, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DAD3240Disco | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | Disco | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAD3240 | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Model | DAD3240[1] | — |
| OEM | Disco[1] | — |
| Equipment type | Automatic Dicing Saw[1] | — |
| Section | Bonding & Packaging[1] | — |
| Maximum substrate size | 200 mm (8 inch)[2] | — |
| Spindle power | 1.8 kW[2] | — |
| Spindle speed range | 6,000 rpm to 60,000 rpm[3] | — |
| Cut speed range | 0.000 to 600 mm/sec[4] | — |
| Index axis range | 210 mm[3] | — |
| Machine width | 650 mm[4] | — |
| Maximum depth left uncut | 0 mm to 10 mm in 0.001 mm increments[3] | — |
| Table stroke (X-axis) | defined by the circular shape of an 8-inch wafer[3] | — |
| Index step size range | 0 mm to 210 mm[3] | — |
| Spindle index range | 0 mm to 210 mm in 0.0001 mm increments[3] | — |
| Spindle stroke (Z-axis) | 210 mm[3] | — |
| Air supply pressure required | 0.4 MPa (minimum 0.35 MPa)[3] | — |
| Chuck vacuum level required | -60 kPa or more[3] | — |
| Display | 15-inch LCD touch panel[2] | — |
| Compatible wafer sizes | 1 inch to 8 inches[4] | — |
| Wafer size capability | 200 mm (8 inch)[6] | — |
| Automatic alignment | Yes[4] | — |
| Substrate shapes | Circular and rectangular[4] | — |
| Operating system | Common to DAD3000 series[4] | — |
| Type | Automatic dicing saw[6] | — |
| Description | Compact, manual, precision dicing saw with an automatic function[4] | — |
| Series | DAD3000 series[4] | — |
| LCD interface | 15 inch LCD touch panel and GUI[4] | — |
| Cut speed | 0.000 to 600 mm/sec[4] | — |
| Wafer Size | — | 6 inch[7] |
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