Comparison ledger
Electroglas 1034, Multitest MT8589, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1034Electroglas | MT8589Multitest |
|---|---|---|
| OEM | Electroglas | Multitest |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | 2000– |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Electroglas 1034 | Multitest MT8589 |
| Specifications | ||
| Type | — | Gravity Handler[1] |
| Contact site | — | dual contact site[1] |
| Temperature range | — | tri-temp from -55 to 155 °C[1] |
| Conversion time | — | kitable; simple conversion in 10 to 15 min.[1] |
| Maximum throughput | — | 4,800 uph[1] |
| Package types | — | 250 different package types (DIP, SO, TO, PLCC)[1] |
| Contacting | — | standard to high power Kelvin[1] |
| Installed base | — | more than 2,000 systems[1] |
| Device size | — | 5 mm to 60 mm device length; width up to 40 mm; pitch down to 0.65 mm[1] |
| Interface | — | SECS-GEM Interface[1] |
| Device spectrum | — | high power contact spring[1] |
| Contact sites | — | Dual contact site[1] |
| Supported package families | — | DIP, SO, TO, PLCC[1] |
| Device pitch | — | Down to 0.65 mm[1] |
| Device length | — | 5 mm to 60 mm[1] |
| Device width | — | Up to 40 mm[1] |
| Applications | — | Automotive power devices, consumer electronics, logic and analog[1] |
| Contact type | — | Standard to high power Kelvin[1] |
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