Waferpedia

Comparison ledger

101versusNSR 2005 G 8 C G Line

EV Group 101, Nikon NSR 2005 G 8 C G Line, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
101EV Group
OEMEV GroupNikon
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run—1991–
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyEV Group 101—
Specifications
OEMEV Group[1]—
Model101[1]NSR 2005 G 8 C[4]
Equipment nameEVG 101 Spray Coater[1]—
NEMO IDevgspraycoat[1]—
Training requiredEVG 101 Training[1]—
Training duration1.50 hours[1]—
Processing techniqueResist Spray Coat (manual)[1]—
Cleanliness"All"[1]—
LocationSNF Paul G Allen L107 Cleanroom[1]—
Wafer diameter (substrate size)up to 300 mm[2]—
Available modulesSpin coat / OmniSpray® / develop[2]—
Wafer handling optionsBowed / warped / thin wafer handling, edge handling[2]—
Dispense optionsVarious resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[2]—
Processing technique (at SNF)Resist Spray Coat (manual)[3]—
Cleanliness group (at SNF)"All"[1]—
Make—Nikon[4]
Light source—G-line[4]
Vintage year—1991[4]
Tool type—Stepper[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]snfguide.stanford.edusnfguide.stanford.edu
  2. [2]evgroup.comevgroup.com
  3. [3]snfguide.stanford.edusnfguide.stanford.edu
  4. [4]Equipment inventory listing