Waferpedia

Comparison ledger

101versusMA1006

EV Group 101, SUSS MicroTec MA1006, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
101EV Group
MA1006SUSS MicroTec
OEMEV GroupSUSS MicroTec
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyEV Group 101SUSS MicroTec MA1006
Cited variants—
  • MA1006 TSA[1]
  • MA1006 TSAIBSA[1]
  • MA1006 TSAII R[1]
  • MA1006 TSA / BSA[2]
Specifications
OEMEV Group[3]SUSS MicroTec[6]
Model101[3]MA1006[6]
Equipment nameEVG 101 Spray Coater[3]—
NEMO IDevgspraycoat[3]—
Training requiredEVG 101 Training[3]—
Training duration1.50 hours[3]—
Processing techniqueResist Spray Coat (manual)[3]—
Cleanliness"All"[3]—
LocationSNF Paul G Allen L107 Cleanroom[3]—
Wafer diameter (substrate size)up to 300 mm[4]—
Available modulesSpin coat / OmniSpray® / develop[4]—
Wafer handling optionsBowed / warped / thin wafer handling, edge handling[4]—
Dispense optionsVarious resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[4]—
Processing technique (at SNF)Resist Spray Coat (manual)[5]—
Cleanliness group (at SNF)"All"[3]—
Tool category on source page—Step Height PROFILOMETER[6]
Resolution—1 micron on 6-inch wafers[7]
Measured linewidth—2 µm at full photoresist height (Shipley 1813 process)[8]
Wafer size—up to 150mm diameter[2]
Mask size—maximum 7" x 7"[2]
Exposure modes—Proximity, soft, hard, vacuum contact[2]
Exposure optics—UV400: 350-450nm; UV300: 280-350nm; Hg-lamp 350W or 1000W[2]
Exposure uniformity—±5% typical for 150mm wafer[2]
Alignment step—1μm steps[2]
Soft contact pressure—2-8 N[2]
Hard contact pressure—Nitrogen pressure 0-2 bar[2]
Vacuum contact level—< -0.8 bar[2]
Dimensions (W×H×D)—ca. 920mm × 1600mm × 870mm[2]
Weight—ca. 450 kg[2]
Power requirement—350W lamp: 1200 VA; 1000W lamp: 2000 VA[2]

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Sources (8)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]nanofab.utah.edunanofab.utah.edu
  3. [3]snfguide.stanford.edusnfguide.stanford.edu
  4. [4]evgroup.comevgroup.com
  5. [5]snfguide.stanford.edusnfguide.stanford.edu
  6. [6]nanofab.utah.edunanofab.utah.edu
  7. [7]jmind.comjmind.com
  8. [8]nanofab.utah.edunanofab.utah.edu